Notice: Undefined variable: video_image_popup in /var/www/clients/client1/web12/web/product.php on line 1084

56 GSPS 8-bit ADC, 2 or 4 channel with XCVU190 UltraScale

  • 8-bit ADC at up to dual 56 GSPS
  • 2 x 56 or 4 x 28 GSPS channels
  • Xilinx UltraScale™ XCVU190 FPGA
  • 16 GB of DDR-4 Memory (2 banks of 64-bit)
  • ADC is 65 nm CMOS process technology
  • Very low power consumption (5 W for the ADC)
  • Double module, mid-size or full-size
  • Calibration warning and over-range flags
  •  –3 dB analog input bandwidth nominally 15 GHz
  • Internal 14 GHz VCO/PLL per I/Q ADC pair
  • Differential analog input: 1.0V PPD
  • Tongue 2 for additional SERDES

Download Datasheet Add to Info Request

add to compare
0

The AMC591 used the Fujitsu MB8AC2070 ADC (Analog to Digital Converter) to provide dual 56 GSPS or quad 28 GSPS from four channels ADC (user selectable). The board is compliant to AMC.0 specifications.

The AMC591 allows the implementation of extremely fast, high-resolution ADCs in CMOS process technology. The ADC is ideal for applications that require ultra-high performance analog and digital processing such as 100G applications. Achieved input bandwidth depends on system configuration and operating conditions, contact VadaTech for details.

The AMC591 has a Xilinx UltraScale™ XCVU190 FPGA which has 1800 DSP Slices. The FPGA interfaces directly to the AMC connectors over both tongue 1 and tongue 2, supporting up to 22 lanes routed to GTY transceivers for board-to-board connectivity (chassis dependent). The FPGA has 2 banks of 64-bit DDR4 memory (16 GB total).

The tongue 2 connections can also provide dedicated lanes to communicate with high speed processors such as VadaTech AMC750/AMC751. Chassis such as the VadaTech VT884/VT815 can accept modules with Tongue two connector.

Key Features
  • 8-bit ADC at up to dual 56 GSPS
  • 2 x 56 or 4 x 28 GSPS channels
  • Xilinx UltraScale™ XCVU190 FPGA
  • 16 GB of DDR-4 Memory (2 banks of 64-bit)
  • ADC is 65 nm CMOS process technology
  • Very low power consumption (5 W for the ADC)
  • Double module, mid-size or full-size
  • Calibration warning and over-range flags
  •  –3 dB analog input bandwidth nominally 15 GHz
  • Internal 14 GHz VCO/PLL per I/Q ADC pair
  • Differential analog input: 1.0V PPD
  • Tongue 2 for additional SERDES
Benefits
  • Highest sampling rate for the module size in the industry
  • Uses MB8AC2070 ADC
  • Low power consumption – CMOS process technology
  • Flexible selection of sample rate and channel count
  • Design utilizes proven VadaTech sub components and engineering techniques
  • Strong mil/aero support
  • Electrical, mechanical, software, and system-level expertise in house
  • Full system supply from industry leader
  • AS9100 and ISO9001 certified company
Specifications
Specifications

Block diagram

Related Products

AMC104

AMC Carrier for PCIe Gen 3 Module

  • AMC PCIe Gen 3 carrier (x4 or x8)
  • Double module, full-size
  • Accept any standard PCIe edge style module
    • connector is x16
  • IPMI 2.0 compliant
View product AMC104 Data Sheet

AMC750

Xeon E5 Processor AMC, PCIe Gen 3, PinoutPlus™

  • with PinoutPlus™
  • Intel® Xeon E5-2648L v4 (Haswell-EP)
  • PCIe Gen 3 on ports 4-7 and 8-11(AMC.1)
  • x16 PCIe Gen 3 via Tongue 2
    • optional PCIe to ports 12-15, 17-20
  • Video output via DVI-I connector
  • GbE to port 0 and 1, SATA to port 2 and 3 (AMC.3)
  • Dual GbE to the front panel
  • Four banks of DDR4 memory with ECC
  • Double module, full-size per AMC.0
  • Optional TPM (Trusted Platform Module)
  • Serial over LAN
  • IPMI 2.0 compliant
View product AMC750 Data Sheet

VT815

9U μTCA.0/ μTCA.4 Chassis, 12 Full-size AMC, 120W/slot

  • μTCA Chassis Platform with rear I/O
  • 19” x 9U x 14.9” deep (with handles 16.23” deep)
  • Full redundancy with dual MicroTCA Carrier Hubs (MCH), dual cooling units and 3 PSUs
  • Up to twelve AMCs: 12 full-size double module slots in front with 12 full-size, double module RTM slots available in the rear
  • High-bandwidth (20-lane) connections between adjacent slots
  • High-speed 30 layer passive backplane (40GbE ready)
  • Redundant FRU information devices and carrier locators
  • Three 1.1 kW AC Power supply for 3.3 kW total
  • Telco alarm
  • FCLKA, TCKA, TCKB, TCLKC AND TCLKD
  • JTAG Switch Module (JSM) Slot on rear of chassis
  • ESD Jack at the top front and back
View product VT815 Data Sheet

Info request

Create a list of products to inquire about for more information or quote request.