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μTCA Conduction Cooled Chassis ½ ATR with 6 AMCs

  • μTCA.3 Conduction Cooled System Platform
  • 1/2 Short Air Transport Rack (ATR)
  • Per ARNIC404A, with NO internal fan (12.62” deep without handle)
  • Customized Front Input/Output (I/O) Panel
  • Connector layout per customer requirement (option per MIL-DTL-M38999)
  • Meets MIL-STD-810F for shock/vibration
  • Meets MIL-STD-461E for EMI
  • Single MCH and Power Module slot
  • Up to 6 mid-size AMCs
  • Radial I2C bus to each AMC
  • High-speed routing on 26 layers
  • FRU information devices with chassis locator
  • CLK1, CLK2 and CLK3
  • No active components on the backplane
  • Secondary mounting provision to allow the chassis to be secured to a base plate

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The VT873 is μTCA.3 1/2 ATR Short chassis that provides six AMC mid-size slots that can accept any AMC.1, AMC.2, AMC.3 and/or AMC.4 with accompanying clamshells for conduction cooling.

The VT873 is designed for the rugged extremes of avionics, naval, and ground vehicles applications. However, the unit is also utilized in outdoor and other rugged applications, including pole-mount communications, energy sector rigs/stations, and more. The VT873 is designed to withstand extreme environmental conditions such as temperature, shock, vibration, corrosion, EMI and altitudes to 25,000 feet (cold plate dependent).

The front cover panel accommodates MIL style M38999 connectors and can be customized tomeet each customer’s unique requirements.

Key Features
  • μTCA.3 Conduction Cooled System Platform
  • 1/2 Short Air Transport Rack (ATR)
  • Per ARNIC404A, with NO internal fan (12.62” deep without handle)
  • Customized Front Input/Output (I/O) Panel
  • Connector layout per customer requirement (option per MIL-DTL-M38999)
  • Meets MIL-STD-810F for shock/vibration
  • Meets MIL-STD-461E for EMI
  • Single MCH and Power Module slot
  • Up to 6 mid-size AMCs
  • Radial I2C bus to each AMC
  • High-speed routing on 26 layers
  • FRU information devices with chassis locator
  • CLK1, CLK2 and CLK3
  • No active components on the backplane
  • Secondary mounting provision to allow the chassis to be secured to a base plate
Benefits
  • Compact-size conduction cooled chassis platform
  • Rugged design meeting MIL-STD-810F for shock and vibration and MIL-STD-461E for EMI
  • Designed for rugged defense, industrial, and outdoor applications
  • Electrical, mechanical, software, and system-level expertise in house
  • Full ecosystem of front and rear boards, enclosures, specialty modules, and test/dev products from onesource
  • AS9100 and ISO9001 certified company
Specifications Related Products

UTC011

DC Power Module, 241W or 460W, Conduction-cooled

  • Single module, full size module per AMC.0
  • Dual 10 to 36 VDC input for 241W option and 18 to 36 VDC input for 460W option
  • Support for power module redundancy and dual IPMI bus
  • 32-bit RISC processor
  • Two banks of 256K flash for redundancy
  • Field upgradable
  • IPMI 2.0 and HPM.1 compliant
  • Without the presence of an MCH the modules can be turned on
  • Menu driven software for ease of configuration
  • Current measure for each module
  • External as well as internal WDT
View product UTC011 Data Sheet

UTC041

μTCA.3 Conduction Cooled

  • Single module, extended size per AMC.0
  • Unified 1 GHz quad-core CPU
    • for MCMC (MicroTCA Carrier Management Controller), Shelf Manager, Clocking, and Fabric management
  • Automatic fail-over
    • with redundant UTC041s
  • GbE base switch
    • w/ dual 100/1000/10G uplink
  • Non-blocking PCIe Gen 3
  • Low-jitter M-LVDS clock distribution crossbar matrix
  • PLL synthesizer for generating any clock frequency disciplined to GPS/IEEE1588
View product UTC041 Data Sheet

VT872

½ ATR Short, 6 AMC, Conduction Cooled

  • μTCA.3 Conduction Cooled System Platform
  • 1/2 Short Air Transport Rack (ATR) per ARNIC404A, with NO internal fan (12.62” deep without handle)
  • Customized Front Input/Output (I/O) Panel Connector layout per customer requirement (option per MIL-DTL-M38999)
  • Designed to meet MIL-STD-810F for shock/vibration and MIL-STD-461E for EMI
  • Single MCH and Power Module slot
  • Up to 6 mid-size AMCs
  • Radial I2C bus to each AMC
  • High-speed routing on 26 layers
  • FRU information devices with chassis locator
  • CLK1, CLK2 and CLK3
  • No active components on the backplane
  • Secondary mounting provision to allow the chassis to be secured to a base plate
  • RoHS compliant
View product VT872 Data Sheet

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