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MTCA Conduction Cooled Chassis with 3 AMCs

  • MTCA.3 Conduction Cooled System Platform
  • Up to 3 mid-size AMCs
  • Front Input/Output (I/O) Panel Connector layout per customer requirement (option per MIL-DTL-M38999)
  • Designed to meet MIL-STD-810F for shock/vibration and MIL-STD-461E for EMI
  • Single MCH and Power Module slot
  • Designed for rugged defense, industrial, and outdoor applications
  • Radial I2C bus to each AMC
  • High-speed routing
  • FRU information devices with chassis locator
  • No active components on the backplane
  • Base plate mounting via a ten 10-32 UNC-B insert bolt pattern
  • Additional secondary mounting provision via a ten 10-32 UNC-B insert bolt pattern on top panel Side Wall Provision for custom Heat Sink Mounting to optimize thermal solution for application

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The VT874 provides three AMC mid-size slots that can accept any AMC.1, AMC.2, AMC.3 and/or AMC.4 with accompanying clamshells for conduction cooling

The VT874 is designed for the rugged extremes of avionics, naval, and ground vehicles applications. It can withstand extreme environmental conditions such as temperature, shock, vibration, corrosion and EMI. The unit can also be utilized in other rugged applications such as pole-mount communications, energy sector rigs/stations etc. Each chassis side wall includes a 7.2" x 4.7" pocket to mount a heat sink via a six 8-32 UNC-B insert bolt pattern.   Provision allows for an optimum heat sink/cold wall thermal design for both the AMC payload configuration and deployed environment.

The front cover panel accommodates MIL style M38999 connectors and can be customized to meet each customer’s unique requirements. Contact VadaTech to discuss your application

FRU Information and Carrier Locator

The VT874 has dual redundant FRU information and Carrier Locators. The Carrier Locator is assigned by mechanical dip switches which are easily accessible. The MCH reads the Locator via its private I2C bus.

Conduction Cooled Chassis and Front Cover

The VT874 is made from lightweight aluminum 6061-T6 and includes a hinged front cover, allowing it to remain intact while serviced in the field. Conduction cooling is achieved through precision-machined card guides in the side walls. The cover utilizes stainless steel captive hardware and self-locking heli-coils to withstand maximum shock and vibration.

No Active Components

Unlike other MTCA chassis, the VT874 has no active components on its back plane. This allows for ease of serviceability.

Scorpion™ Software

VadaTech’s Scorpionware software can be used to access information about the current state of the Shelf or the Carrier, obtain information such as the FRU population, or monitor alarms, power management, current sensor values, and the overall health of the Shelf. The software GUI is very powerful, providing a Virtual Carrier and FRU construct for a simple, effective interface.

Key Features
  • MTCA.3 Conduction Cooled System Platform
  • Up to 3 mid-size AMCs
  • Front Input/Output (I/O) Panel Connector layout per customer requirement (option per MIL-DTL-M38999)
  • Designed to meet MIL-STD-810F for shock/vibration and MIL-STD-461E for EMI
  • Single MCH and Power Module slot
  • Designed for rugged defense, industrial, and outdoor applications
  • Radial I2C bus to each AMC
  • High-speed routing
  • FRU information devices with chassis locator
  • No active components on the backplane
  • Base plate mounting via a ten 10-32 UNC-B insert bolt pattern
  • Additional secondary mounting provision via a ten 10-32 UNC-B insert bolt pattern on top panel Side Wall Provision for custom Heat Sink Mounting to optimize thermal solution for application
Benefits
  • Compact-size conduction cooled chassis platform
  • Full ecosystem of front and rear boards, enclosures, specialty modules, and test/dev products from one source
  • Electrical, mechanical, software, and system-level expertise in house
  • AS9100 and ISO9001 certified company
  • Full system supply from industry leader
Specifications Related Products

AMC713

QorIQ P5010/5020 Processor AMC, PCIe

  • PrAMC with NXP QorIQ P5010/P5020
  • Up to16 GB DDR3 with ECC
  • PCIe Gen2 on Ports 4-7 and 8-11 per AMC.1
  • Configurable as Host (Root Complex) or Agent
  • 10GbE with SFP+ interface
  • Dual GbE per AMC.2 on Ports 0-1
  • Dual SATA per AMC.3
  • Single-module, mid-size per AMC.0
  • Option for up to 32 GB SDHC
  • Conduction Cooled option available
View product AMC713 Data Sheet

UTC003

for Conduction Cooled μTCA Chassis

  • Single module, full size module per AMC.0
  • 400MHz RISC CPU with 64MB DDR
    • for MCMC (MicroTCA Carrier Management Controller) and Shelf Manager
  • Redundant boot system
    • ensures fail-safe upgrades
  • Fail-over with dual UTC003 in system
  • GbE to each AMC (Layer 2 managed)
  • Non-blocking PCIe x4 Gen 2 to each AMC slot with option for SRIO or 10GbE (Layer 3 managed)
  • Fabric clock with Spread Spectrum capability
  • Linux 2.6 embedded OS
  • IPMI 2.0 and HPM.1 compliant
  • Can run as an IPMI protocol analyzer to monitor all the I2C Busses
View product UTC003 Data Sheet

UTC011

DC Power Module, 241W or 460W, Conduction-cooled

  • Single module, full size module per AMC.0
  • Dual 10 to 36 VDC input for 241W option and 18 to 36 VDC input for 460W option
  • Support for power module redundancy and dual IPMI bus
  • 32-bit RISC processor
  • Two banks of 256K flash for redundancy
  • Field upgradable
  • IPMI 2.0 and HPM.1 compliant
  • Without the presence of an MCH the modules can be turned on
  • Menu driven software for ease of configuration
  • Current measure for each module
  • External as well as internal WDT
View product UTC011 Data Sheet

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