8U uTCA.4 Chassis Platform

  • uTCA.4 Chassis Platform with rear I/O
  • 19” x 8U x 14.9” deep (with handles 16.23” deep)
  • Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and quad Power Modules
  • Up to twelve AMCs: 12 mid-size double module front module with 12 mid-size double module RTMs
  • Provision to route cables from the front to the back
  • Radial I2C bus to each AMC
  • High-speed 30 layer passive backplane
  • Redundant FRU information devices and carrier locator
  • Dual 1000W AC Power supply option Telco Alarm FCLKA, TCKA, TCKB, TCLKC AND TCLKD
  • JTAG Switch Module (JSM) Slot
  • ESD Jack at the top front

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The VT811 is a 8U μTCA chassis that provides 12 AMC mid size double module slots that can accept any AMC.1, AMC.2, AMC.3 and/or AMC.4. It provides FCLKA, TCLKA, TCLKB, TCLKC and TCLKD to each slot. The VT811 has full redundancy. It’s capable of having redundant MCH, Power Modules, as well as redundant Cooling Units (CU) for high availability. Ports 2-3, 12-15 and 17-20 are connected among the slots per the uTCA.4 recommendation. The VT811 has a Telco Alarm as well as Redundant FRU information devices and carrier locators. The VT811 has a JSM slot which routes to each JTAG port of the AMC. The VT811 has provision to route cables from the front to back via a conduit on the chassis.

Key Features
  • uTCA.4 Chassis Platform with rear I/O
  • 19” x 8U x 14.9” deep (with handles 16.23” deep)
  • Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and quad Power Modules
  • Up to twelve AMCs: 12 mid-size double module front module with 12 mid-size double module RTMs
  • Provision to route cables from the front to the back
  • Radial I2C bus to each AMC
  • High-speed 30 layer passive backplane
  • Redundant FRU information devices and carrier locator
  • Dual 1000W AC Power supply option Telco Alarm FCLKA, TCKA, TCKB, TCLKC AND TCLKD
  • JTAG Switch Module (JSM) Slot
  • ESD Jack at the top front
Benefits
  • Lightweight aluminum design
  • Ideal for High Energy Physics and other applications requiring rear I/O
  • Vinyl tabs on fan trays for smooth insertion/extraction
  • Cable channel below card cage for clean cable management
  • Design utilizes proven VadaTech subcomponents and engineering techniques
  • Electrical, mechanical, software, and system-level
     expertise in house
  • Full ecosystem of front and rear boards, enclosures, specialty modules, and test/dev products from one source
  • AS9100 and ISO9001 certified company
Specifications Related Products

AMC522

MTCA.4 AMC Dual DAC, 16-bit @ 250 MSPS

  • Dual channel DAC 16-bit @ 250 MSPS (MAX5878)
  • Compliant to MTCA.4, double module, mid-size (full-size optional) with rear I/O
  • Xilinx Kintex-7 FPGA
  • Dual PCIe x4 or PCIe x8
  • JTAG interface port
  • AMC.1, AMC.2, AMC.4 compliant (FPGA programmable)
  • IPMI v2.0 compliant
View product AMC522 Data Sheet

AMC725

Xeon E3 Processor, 10GbE, MTCA.4, Double Module, AMC

  • Double-module, mid-size per AMC.0 and MTCA.4
  • Intel® Xeon E3 processor options with PCH
  • DVI graphics (SM750 w/ 16 MB DDR) up to 1920x1440 resolution
  • PCIe Gen3 on ports 4-7 and 8-11 or single PCIe x8 on ports 4-11 (AMC.1)
  • GbE on ports 0 and 1 (AMC.2) and SATA on ports 2 and 3 (AMC.3)
  • PCIe Gen3 x8, dual SATA and quad USB to RTM
  • Dual 10GbE via SPF+ and dual GbE via RJ-45 to front panel
View product AMC725 Data Sheet

UTC017

AC Power Module, 500W, Double Module

  • Double module, full size module per AMC.0
  • Universal AC input (85-265 VAC), 500W
  • Very low ripple voltage on the +12V
  • Hot swappable and support for power module redundancy
  • Dual IPMI bus
  • 32-bit RISC processor
  • Two banks of 256K flash for redundancy
  • Blue, Red, Amber and Green LEDs
  • Field upgradable
  • IPMI 2.0 and HPM.1 compliant
  • Without the presence of an MCH the modules can be turned on
  • Menu driven software for ease of configuration
  • Current measure for each module
  • Available in uTCA.1, uTCA.2 and uTCA.3
View product UTC017 Data Sheet

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