VT860
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5U uTCA Chassis, 12 AMC (4 Full, 6 Mid, 2 Compact Size)
- 5U μTCA System Platform
- 19” x 5U x 10.5” deep (with handles 12” deep)
- Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules
- Up to twelve AMCs: four full size, six mid size and two compact size
- Dual star passive 26 layer backplane
- Radial I2C bus to each AMC
- Redundant FRU information devices and carrier locator
- 1000W AC Power supply option
- Telco Alarm andJTAG Switch Module (JSM) slots with front port access
- CLK1, CLK2 and CLK3
- ESDJack at the top front
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The VT860 is a 5U μTCA chassis that provides four AMC full size, six mid size and two compact slots that can accept any AMC.1, AMC.2, AMC.3 and/or AMC.4. It provides CLK1, CLK2, and CLK3 to each slot in addition to the JTAG signals. The VT860 has full redundancy. It’s capable of having redundant MCH, Power Modules, as well as redundant Cooling Units for high availability. There is an option for redundant/non-redundant clock per μTCA specification. The CLK3 option can be configured for the Fabric clock as well as Telcom clock. There is an option for Port 2 and 3 to be directly connected among the adjacent AMCs or to the fabric B (AMC.3 SATA/SAS switch option on the MCH). The chassis has a JTAG Switch Module (JSM) slot per μTCA specification. This provides transparent communication between the front JTAG port and the selected AMC device.The VT860 has a Telco Alarm as well as Redundant FRU information devices and carrier locators.
Key Features
- 5U μTCA System Platform
- 19” x 5U x 10.5” deep (with handles 12” deep)
- Full redundancy with dual MicroTCA Carrier Hub (MCH), dual Cooling Units and dual Power Modules
- Up to twelve AMCs: four full size, six mid size and two compact size
- Dual star passive 26 layer backplane
- Radial I2C bus to each AMC
- Redundant FRU information devices and carrier locator
- 1000W AC Power supply option
- Telco Alarm andJTAG Switch Module (JSM) slots with front port access
- CLK1, CLK2 and CLK3
- ESDJack at the top front
Benefits
- Wide variety of MicroTCA Chassis Platforms
- Design utilizes proven VadaTech subcomponents and engineering techniques
- Electrical, mechanical, software, and system-level expertise in house
- Full ecosystem of front and rear boards, enclosures, specialty modules, and test/dev products from one source
- AS9100 and ISO9001 certified company
Specifications
Related Products
AMC720
Xeon E3-1125 Processor AMC, PCIe
- Intel® Xeon™ E3 processor
- Conduction cooled version available
- Single module, mid-size per AMC.0
- PCIe Gen2
- Gen3 on v2 option
- x4 on ports 4-7 and 8-11 or single PCIe x8 on ports 4-11 (AMC.1)
- GbE to port 0 and 1 (AMC.2) and SATA to port 2 and 3 (AMC.3)
- Dual GbE to the front panel
- Up to 16 GB of DDR3 w/ ECC and 32 GB Flash
- Option for 32 GB SATA drive
- Serial over LAN
- IPMI 2.0 compliant
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AMC720 Data Sheet
UTC002
MicroTCA Carrier Hub, 2nd Generation
- 400 MHz CPU with 64 MB DDR for MCMC (MicroTCA Carrier Management Controller) and Shelf Manager
- Layer 2 managed GbE to each AMC (optional)
- Non-blocking PCIe Gen 3 (x4), to each slot with option for SRIO or 10GbE (Layer 2 managed)
- Redundant boot system to ensure fail-safe upgrades
- Automatic fail-over with dual UTC002
- SAS/SATA to each AMC (optional)
- Telecom/GPS clock (Stratum-3)
- Fabric clock with spread spectrum capability
- Single module, full size per AMC.0
- HPM.1 and IPMI 2.0 compliant
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UTC002 Data Sheet
UTC010
MicroTCA DC Power Module, 792W
- Dual -36VDC to -75VDC input,
- 792W (available in 396W)
- Hot swappable with support for power module redundancy
- Available in MTCA.3 Conduction Cooled version
- Dual IPMI bus
- 32-bit RISC processor
- Two banks of 256K flash for redundancy
- Modules can be turned on without an MCH in the system
- External as well as internal WDT
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UTC010 Data Sheet
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